Microleakage of three resin adhesives
using modified application protocols
Authors :
- Chuthinat Intakanok D.D.S.
- Sirivimol Srisawasdi, D.D.S., M.S., Ph.D.
Abstract :
Objective To evaluate microleakage of class V resin composite restorations when using three resin adhesives according to manufacturers' instructions compared to the modified application protocols.
Materials and methods Standard class V cavities were prepared in 60 human extracted premolars. Three adhesives were investigated; Optibond FL, Clearfil SE Bond and Clearfil S3 Bond. Adhesives used according to manufacturers' instructions were used as controls, compared to groups using modified application protocols. After 5,000 thermal cycles, microleakage test was performed and the results were analyzed using Chi-Square and Wilcoxon Signed Rank tests at a 95% confidence level.
Results Clearfil SE Bond samples exhibited lower enamel leakage values, compared to controls, when beforehand enamel was etched with phosphoric acid; however, no statistically significant difference was shown. Leakage of Clearfil S3 Bond at enamel margin of the modified protocol group was found to be statistically lower than the control group. Modified application of Optibond FL presented less leakage at dentin margin, compared to control group, significantly.
Conclusion There was no difference in leakage prevention at enamel margin of Clearfil SE Bond when used according to manufacturersû instructions compared to the modified protocol. In contrast to Clearfil S3 Bond, leakage was found to be significantly lower in group that enamel was beforehand etched compared to that found in group using the manufacturersû protocol. Optibond FL group showed significant less leakage when dentin was only treated with primer.
(CU Dent J. 2009;32:23-38)
Keywords :
microleakage; self-etching adhesive; selective acid etching
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